Cantilever Paddles are the key parts of wafer loading systemin semiconductor and solar applications. Cantilever Paddles display high temperature capability with maximum wafer loads and no deflection. It is suitable for robot auto-mated load stations and cross section of Cantilever Paddles，retrofits to larger wafer sizes can be done using existing furnace tubes. Cantilever Paddles greatly extend processing times between cleaning and drastically reduce particles in LPCVD applications. It is because the thermal expansion between Cantilever Paddles and typical process deposits is matched very well.

Silicon carbide cantilelet, stable in high temperature environment, good stiffness, no deformation, makes a larger-specific wafer production possible and is a key component of semiconductor wafer loading systems, especially for robotic loading and handling systems. Silicon carbide cantiledle has thermal expansion coefficient similar to that of the LPCVD coating and can greatly extend the maintenance cleaning cycle and drastically reduces pollutants in LPCVD applications.
Grinding discs, suction cups are important processing consumables (equipment) for silicon wafer production in the semiconductor industry. During the processing of silicon wafers, especially when high-speed grinding or polishing, it is difficult to ensure the flatness of the silicon wafer with the wear and thermal deformation of the grinding disc. Silicon carbide grinding disc, due to the high hardness, low abrasion and similar coefficient of thermal expansion as the silicon wafer, allows high-speed grinding and polishing. Especially in recent years the silicon wafer sizes have become increasingly large which calls for higher requirements on the quality and efficiency, the use of silicon carbide grinding discs improve the quality and efficiency of silicon wafers processing. Meanwhile, silicon carbide grinding disc can also be used to grind and polish the plate or block made from other materials.